Dg. Gromov et al., COSI2 FORMATION IN CONTACT SYSTEMS BASED ON TI-CO ALLOY WITH LOW COBALT CONTENT, Applied physics A: Materials science & processing, 61(5), 1995, pp. 565-567
The process of integrated-circuit contact formation based on Ti-Co all
oy with low content of cobalt has been investigated. By AES and XRD it
is shown that nitrogen doping of the alloy film during magnetron depo
sition and its subsequent annealing at 800-850 degrees C allow simulta
neously to obtain a CoSi2 contact layer and a diffusion barrier layer
on the basis of TiN. Electrical characteristics of Schottky barrier an
d ohmic contacts have been studied.