THE INTERFACE BETWEEN METALLIC SUBSTRATES AND LAYERS OF ELECTRODEPOSITED CO-W AMORPHOUS-ALLOYS

The process of formation of deposits of Co-W amorphous alloys on coppe r and mild steel substrates has been studied. For the ahoy layers plat ed on copper, the content of Co and VV in the amorphous coverage has b een examined and found to be a function of the distance from the subst rate surface. The examination was based on the quantitative EDS and WD S analysis of the cross-sections of the alloy layers. It has been foun d that an intermediate inner layer is formed on the copper substrate, and the adhesion of the alloy to this substrate is very good. The adhe sion of the ahoy layers to steel was much weaker compared to copper. W e relate this difference to the absence of the interface layer between the alloy and steel. The difference found for the two substrates corr elates well with the differences in the crystal structures of the subs trates and the deposited metals. (C) 1998 Published by Elsevier Scienc e S.A. All rights reserved.