HIGH-DENSITY PACKAGING - DESIGNING AND IMPLEMENTING PRODUCTS

Authors
CHANDLER N
Citation
N. Chandler, HIGH-DENSITY PACKAGING - DESIGNING AND IMPLEMENTING PRODUCTS, Electronic engineering, 70(861), 1998, pp. 71
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronic engineering → ACNP
ISSN journal
00134902
Volume
70
Issue
861
Year of publication
1998
Database
ISI
SICI code
0013-4902(1998)70:861<71:HP-DAI>2.0.ZU;2-D
Abstract
High density packaging technology overcomes the limiting effects of pr evious technologies and enables the electronics to achieve higher leve ls of integration and functionality. Designers need a wide range of in formation to make the most of miniaturisation, which will be a crucial factor for the successful implementation of tomorrow's products.