The silicide formation characteristics from composition profiles creat
ed on Si by codepositions was investigated. It was shown that a thin i
nterfacial amorphous TiSix layer, with x similar to 0.5-1, deposited b
etween Si and the Ti film led to a significant reduction in the observ
ed C49-->C54 TiSi2 transformation temperature. The presence of the amo
rphous interfacial TiSix layer slowed down the initial silicidation ra
te, but promoted the nucleation of the final C54 TiSi2 phase. Predepos
ition and preannealing were also found to facilitate the growth of C54
TiSi2, as was growth from codeposited full TiSix layers with Ti-rich
compositions. The efficacy of the (interfacial) TiSix layer was demons
trated for different temperature ramp rates and for a variety of subst
rates including undoped alpha-Si, preamorphized n(+)-Si. and preamorph
ized p(+)-Si. But this effect was found to be absent on single crystal
Si. Possible mechanisms of the observed effects were discussed. (C) 1
997 American Institute of Physics.