Al0.3Ga0.7As layers were grown by molecular beam epitaxy using substra
te temperature 200-300 degrees C, tetrameric As and two values of As/G
a+Al flux ratio i.e. 3 or 8. The post-growth. annealing was performed
in situ at 600 degrees C for 20 min under As-overpressure. The samples
were characterised by reflection high-energy electron diffraction, tr
ansmission electron microscope and room-temperature I-V measurements o
f n(+)/LT grown layer /n(+) resistors. The resistivity and trap-filled
limited voltage have been determined. The best layers exhibited rho o
f the order of 10(9) Ohm cm, were monocrystalline, uniformly precipita
ted and without dislocations.