T. Radhakrishnan, AN ANALYSIS OF DIMENSIONAL AND LOCATIONAL VARIATIONS IN SURFACE-MOUNTED COMPONENT ASSEMBLY, Computer-integrated manufacturing systems, 11(3), 1998, pp. 191-197
Citations number
10
Categorie Soggetti
Computer Science Interdisciplinary Applications","Operatione Research & Management Science","Computer Science Interdisciplinary Applications","Engineering, Manufacturing","Operatione Research & Management Science
This study focuses on the errors involved in the component fetching an
d placement phase of pc board assembly with surface-mounted components
. Various critical dimensional and locational parameters involved in t
his phase, which can lead to mis-assembly, are identified. The complex
relationships between these parameters, which govern the proper compo
nent (pin) placement on the pc board (pad), are mathematically modeled
, using both additive and statistical error compounding methods. The u
se of the model is shown with a quantitative example. (C) 1998 Elsevie
r Science Ltd. All rights reserved.