As the gate oxide thickness decreases below 2 nm, the gate leakage cur
rent increases dramatically due to direct tunneling current. This larg
e gate leakage current will be an obstacle to reducing gate oxide thic
kness for the high speed operation of future devices. A MOS transistor
with Ta2O5 gate dielectric is fabricated and characterized as a possi
ble replacement for MOS transistors with ultra-thin gate silicon dioxi
de. Mobility, I-d-V-d. I-d-V-g, gate leakage current, and capacitance-
voltage (C-V) characteristics of Ta2O5 transistors are evaluated and c
ompared with SiO2 transistors. The gate leakage current is three to fi
ve orders smaller for Ta2O5 transistors than SiO2 transistors.