CONDUCTIVE POLYMERS FOR MICROELECTRONIC PACKAGING - CHIP BONDING TO POLYMER-FILMS

A novel flipchip-like microelectronic packaging technology for bonding integrated circuits to polymer foils using laser micromachining techn ique anti a wet chemical metallization process of conductive polymers has been developed. This paper will focus on the deposition of polypyr role onto the aluminum surface and the characterization of the thin pm using scanning electron microscopy, auger electron spectroscopy and X ray photoelectron spectroscopy. The conductive polymer is metallized b y copper electroplating for connecting the integrated circuit to the p olyimide foil. Electrical measurements were performed on patterned sub strates with a layer system consisting of polyprrole/copper/tin-lead d eposited on aluminum bond pads. The characteristic current/voltage cur ve shows an ohmic contact behavior which is of fundamental importance for the development of chip bonding technology using conductive polyme rs. (C) 1998 Joh Wiley & Sons, Ltd.