THE ELECTRODEPOSITION OF COPPER IN THE PRESENCE OF FRIGHTENING AND SMOOTHING AGENTS

Modern concepts of the mechanism of the action of surface-active subst ances (SASs) as brightening and smoothing agents during the electrolyt ic copper plating are reviewed. The data on the effect of the adsorpti on of either individual or composite brightening additives on the kine tics of copper electrodeposition are considered. The role of the chemi cal and electrochemical transformations of additives in copper-plating baths and the complex formation of copper ions with SASs are discusse d. The data on the action of additives on the crystallization stages i n the course of one- or multilayer copper deposition are considered. I nformation about the modern baths for bright copper plating is given. New baths with the brightening agents of the Midel series are proposed .