COMPARISON OF CURE CONDITIONS FOR RIGID-ROD EPOXY AND BISPHENOL-A EPOXY USING THERMOMECHANICAL ANALYSIS

Authors
SU WFA SCHOCH KF SMITH JDB
Citation
Wfa. Su et al., COMPARISON OF CURE CONDITIONS FOR RIGID-ROD EPOXY AND BISPHENOL-A EPOXY USING THERMOMECHANICAL ANALYSIS, Journal of applied polymer science, 70(11), 1998, pp. 2163-2167
Citations number
3
Categorie Soggetti
Polymer Sciences
Journal title
Journal of applied polymer science → ACNP
ISSN journal
00218995
Volume
70
Issue
11
Year of publication
1998
Pages
2163 - 2167
Database
ISI
SICI code
0021-8995(1998)70:11<2163:COCCFR>2.0.ZU;2-L
Abstract
Thermomechanical analysis was used to compare cure conditions of a bis phenol A epoxy resin composition and the same composition prepared wit h a rigid rod biphenol epoxy resin. The rigid rod system exhibited a l ower curing rate and lower thermal expansion than did the bisphenol A system. The glass transition and thermal expansion of the rigid rod sy stem can be varied by manipulation of the ratio of curing agent to epo xy. (C) 1998 John Wiley & Sons, Inc.