A. Mcnab et al., ULTRASONIC TRANSDUCERS FOR HIGH-TEMPERATURE APPLICATIONS, IEE proceedings. Science, measurement and technology, 145(5), 1998, pp. 229-236
There is an increasing demand for ultrasonic transducers to work at hi
gh temperatures. Transducers operating in the range from 400 to 1000 d
egrees C are being applied in the power, process, automotive and aeroe
ngine industries, as well as in materials research. To date, the major
ity of high temperature transducer designs have been based on adaptati
ons of conventional single and dual-element probes for nondestructive
testing (NDT). Such designs are outlined. It is noted, however, that t
he attempt to construct high temperature versions of conventional tran
sducers has led overcomplicated, expensive structures. In particular,
they are modelled on probes used for scanning at ambient temperatures,
although scanning is unlikely to be possible at high temperatures. An
alternative approach is therefore described, based on the monolithic
ultrasonic array structure. This offers not only lower transducer cost
s, but also full electronic control of the ultrasonic beam angle and e
mission point, thus facilitating inspection of a region within a test
component using only one or two devices in fixed positions. Typical re
sults demonstrating the beam-steering performance of the array, as wel
l as those from B-scan time-of-flight testing, are presented. It is co
ncluded that the problems of transducer development for ultrasonic, hi
gh-temperature NDT are not yet completely solved, and that further eff
ort is required in the key areas of materials science and transducer s
tructure. Moreover, a simple design with the minimum of bond lines is
most likely to succeed on the grounds of cost and reliability.