ELASTIC REBOUND BETWEEN AN INDENTER AND A LAYERED SPECIMEN - PART II - USING CONTACT STIFFNESS TO HELP ENSURE RELIABILITY OF NANOINDENTATION MEASUREMENTS

Measurement of nanoindentation hardness and modulus relies on the dete rmination of the projected area of the indent, A, usually done by one of two methods: (1) indirectly, based on depth of indentation and cali brated indenter shape; or (2) directly, using a microscope image. In t his article we introduce a new analysis to improve the reliability and precision of nanoindentation data. The analysis examines the specimen properties from perspective of the parameter (L0C)-C-1/2 = H-1/2/E-ef f + CmL0 where C is the measured unloading compliance, C-m is the mach ine compliance, L-0 is the load, H is the hardness, and E-eff is the s pecimen-indenter contact modulus, which is a function of the size of t he indent, and which can be calculated based on a theoretical model. W e apply this analysis to the characterization of 1-2 mu m thick molybd enum films deposited on silicon.