EFFECTS OF HIGH-DOSE BI- AN ATOMIC-FORCE AND TRANSMISSION ELECTRON-MICROSCOPY STUDY( IMPLANTATION ON SI )

Citation
C. Angelov et al., EFFECTS OF HIGH-DOSE BI- AN ATOMIC-FORCE AND TRANSMISSION ELECTRON-MICROSCOPY STUDY( IMPLANTATION ON SI ), Vacuum, 51(2), 1998, pp. 285-288
Citations number
8
Categorie Soggetti
Physics, Applied","Material Science
Journal title
VacuumACNP
ISSN journal
0042207X
Volume
51
Issue
2
Year of publication
1998
Pages
285 - 288
Database
ISI
SICI code
0042-207X(1998)51:2<285:EOHBAA>2.0.ZU;2-5
Abstract
The effect of bismuth ion implantation (dose range 10(15)-10(18) cm(-2 )) On the surface morphology of monocrystalline silicon was investigat ed by Atomic Force Microscopy (AFM) and Cross-Sectional Transmission E lectron Microscopy (XTEM) and the data obtained compared. The low leve ls of roughness observed at dose interval 10(15)-6 x 10(15) cm(-2) cou ld be related to an amorphous layer created at the target surface. Rou ghness increased at a dose of 8 x 10(15) cm(-2), where drastic changes in the morphology of the amorphous layer began, i.e. with nonepitaxia l recrystallization of Si and simultaneous agglomeration of Si in nano crystals. The maximum surface roughness at a dose 1 x 10(18) cm(-2) wa s related to the specific erosion of the surface in the form of hilloc ks connected to the extremely large value of the sputtering yield of B i (61.8 at. i.(-1)) in comparison with the sputtering yield of Si (3 a t. i.(-1)). (C) 1998 Elsevier Science Ltd All rights reserved.