Adsorption and reaction of disilane (Si2H6) on Si(111)-(7 x 7) surface
s have been studied in the temperature range 300-760 K by scanning tun
neling microscopy. In the entire temperature range the interaction of
Si2H6 with Si(111)-(7 x 7) is dissociative. At room temperature it lea
ds to continuous reactions of adatom dangling bonds with hydrogen atom
s, which are released in the decomposition process. Protruding surface
species observed after prolonged Si2H6 exposition are assigned to dep
osited SiHx fragments. After exposures to 120 L at temperatures betwee
n 400 and 690 It a variety of surface structures, such as SixHy cluste
rs, hydrogen terminated adatoms and disordered regions, are observed.
At 730-760 K growth leads to the formation of triangular islands witho
ut stacking faults and by incorporation of Si at steps with the grown
areas exhibiting a defective adatom structure. Re-annealing to 800 K r
estores the DAS structure and allows the amount of silicon deposited t
o be determined. The initial sticking coefficient for dissociative Si2
H6 adsorption at 300 K is determined as S-0 = 8.5 x 10(-5). Silicon de
position proceeds via an activated adsorption process. The value of th
e activation energy is determined as approximate to 0.1 eV between 300
K and 650 K, while it is 1.1 eV between 650 K and 760 K, pointing tow
ard an additional reaction channel at temperatures above 650 K. (C) 19
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