CARRIER POCKET ENGINEERING TO DESIGN SUPERIOR THERMOELECTRIC-MATERIALS USING GAAS ALAS SUPERLATTICES/

Citation
T. Koga et al., CARRIER POCKET ENGINEERING TO DESIGN SUPERIOR THERMOELECTRIC-MATERIALS USING GAAS ALAS SUPERLATTICES/, Applied physics letters, 73(20), 1998, pp. 2950-2952
Citations number
19
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
73
Issue
20
Year of publication
1998
Pages
2950 - 2952
Database
ISI
SICI code
0003-6951(1998)73:20<2950:CPETDS>2.0.ZU;2-G
Abstract
A large enhancement in the thermoelectric figure of merit for the whol e superlattice, Z(3D)T, is predicted for short-period GaAs/AlAs superl attices relative to bulk GaAs. Various superlattice parameters (superl attice growth direction, superlattice period, and layer thicknesses) a re explored to optimize Z(3D)T, including quantum well states formed f rom carrier pockets at various high symmetry points in the Brillouin z one. The highest room-temperature Z(3D)T obtained in the present calcu lation is 0.41 at the optimum carrier concentration for either (001)- or oriented GaAs (20 Angstrom)/AlAs (20 Angstrom) superlattices, which is about 50 times greater than the corresponding ZT for bulk GaAs. (C ) 1998 American Institute of Physics. [S0003-6951(98)01546-0].