ELASTIC-MODULI AND ACTIVATION-ENERGIES FOR AN EPOXY M-XDA SYSTEM BY DMA AND DSC/

Citation
L. Nunez et al., ELASTIC-MODULI AND ACTIVATION-ENERGIES FOR AN EPOXY M-XDA SYSTEM BY DMA AND DSC/, JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 52(3), 1998, pp. 1013-1022
Citations number
15
Categorie Soggetti
Chemistry Analytical","Chemistry Physical
Journal title
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
ISSN journal
13886150 → ACNP
Volume
52
Issue
3
Year of publication
1998
Pages
1013 - 1022
Database
ISI
SICI code
0368-4466(1998)52:3<1013:EAAFAE>2.0.ZU;2-Q
Abstract
The influence of the resin/diamine ratio on the properties of the syst em diglycidyl ether of bisphenol A (BADGE n=0/m-xylylenediamine) (m-XD A) was studied. Variation of this ratio resulted in significant effect s on the cure kinetics and final dynamic mechanical properties of the product material. The study was made in terms of storage modulus (E'), loss modulus (E '') and molecular mass between cross-links (M-c) at d ifferent ratios. Two geometries (cylindrical and rectangular) were con sidered. The influence of temperature was studied through the activati on energy (E-a), which depends on the epoxy/amine ratio and the geomet ry of the samples. Glass transition temperatures (T-g) and glass trans ition temperatures for thermosets with null degree of conversion (T-go ) were determined by DSC. T-g decreases when amounts of curing agent g reatly in excess of the stoichiometric compositon were used.