DOUBLE-LAYER STRUCTURE, CORROSION AND CORROSION INHIBITION OF COPPER IN AQUEOUS-SOLUTION

In situ STM results on the surface structure of Cu(100) electrodes in sulfuric and hydrochloric acid solution, both at potentials in the dou ble-layer range and at the onset of anodic Cu dissolution, are present ed. The Cu surface structure, morphology and dynamic behavior are foun d to depend strongly on the anion species and on the potential. In bot h electrolytes dissolution of pure Cu surfaces proceeds by a step-flow mechanism. In the presence of organic corrosion inhibitors (benzotria zole, self-assembled alkanethiolmonolayers) the otherwise dominant ste p-flow etching is greatly inhibited and etch pit formation is observed at more anodic potentials.