We report on the latest results obtained from the development of a fab
rication technology for PIN radiation detectors with on-chip front-end
junction field effect transistors (JFETs) integrated on high-resistiv
ity, FZ silicon. P-doped polysilicon back-side gettering prevented car
rier lifetime degradation in spite of the relatively high thermal budg
et characterizing the fabrication process, allowing very low leakage c
urrents (similar or equal to 1nA/cm(2) at full depletion) to be obtain
ed. Results from JFETs electrical characterization are presented, show
ing high transconductance and output resistance values as well as low
gate currents and input capacitance. JFETs performance is not affected
by the high reverse-bias voltage required for detector operation, mak
ing these devices suitable for the fabrication of monolithical preampl
ifiers integrated on the detector chip. (C) 1998 Elsevier Science B.V.
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