R. Schlaf et al., INFLUENCE OF ELECTROSTATIC FORCES ON THE IMAGING PROCESS IN SCANNING-TUNNELING-MICROSCOPY, Thin solid films, 331(1-2), 1998, pp. 203-209
We performed scanning tunneling microscopy (STM) experiments on layere
d semiconductor compound surfaces which suggest a significant influenc
e of electrostatic forces (EF) on the imaging process. We performed ST
M experiments at varying tunneling biases on plain MoTe2 and ultrathin
epitaxial WS2 films on MoTe2 substrates. We observed tunneling bias d
ependent height changes of up to several nanometers of layer edges and
layer terraces. Both of the samples showed height increases of up to
8 nm for step edges depending on the tunneling bias. Only at certain b
iases the values known from X-ray diffraction for the layer thickness
were approached. These observations cannot be explained solely by elec
tronic effects and tunneling probability changes. Our evaluation of th
e results shows that mechanical changes of the morphology caused by va
rying EF interaction between tip and sample are likely to be the cause
of these phenomena. In order to investigate the magnitude and influen
ce of EF between tip and sample more closely we performed additional e
xperiments with bias applied atomic force microscopy (BAAFM) which ind
icate a strong influence of EF on the imaging process. Atomic force cu
rves with additionally applied bias yielded that the EF are in the ran
ge of several ten to several hundred nN depending on the tunneling bia
s. The corresponding charge density on tip and sample suggests the pre
sence off single electrons and holes at the interface instead of homog
eneous charge densities which might result in a pulsed EF interaction
between tip and sample. (C) 1998 Elsevier Science S.A. All rights rese
rved.