INTERFACE REACTION BETWEEN AG-PD CONDUCTOR AND PD-SN SOLDER

Authors
MORIYA Y YAMADE Y SHINYA R
Citation
Y. Moriya et al., INTERFACE REACTION BETWEEN AG-PD CONDUCTOR AND PD-SN SOLDER, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(4), 1998, pp. 394-397
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging → ACNP
ISSN journal
10709894
Volume
21
Issue
4
Year of publication
1998
Pages
394 - 397
Database
ISI
SICI code
1070-9894(1998)21:4<394:IRBACA>2.0.ZU;2-#
Abstract
The intermetallic compound layer between Pb-Sn solder and Ag-Pd conduc tor after aging at 150 degrees C has been studied, Elemental and phase distributions of this layer has been probed using SEM, I, EPMA and ED X, The investigation of the microstructure of the layer with EPMA line r analysis reveals segregation of Ag-rich and Pd-rich phases Quantitat ive EDX analysis results show that the Ag-rich phase contains Ag and S n with the Ag/Sn ratio around 3/1, and the Pd-rich phase Pd and Sn wit h the Pd/Sn ratio around 1/4. These phases are confirmed to be the int ermetallic compounds Ag3Sn and PdSn1, respectively.