D. Xu et al., SELF-COMPENSATION OF SHORT-CHANNEL EFFECTS IN SUB-0.1-MU-M INALAS INGAAS MODFETS BY ELECTROCHEMICAL ETCHING/, IEEE electron device letters, 19(12), 1998, pp. 484-486
We show that by making full use of the features of electrochemical etc
hing in InAlAs/InGaAs heterostructures, deep gate grooves with small s
ide etching can be fabricated. The most important advantage of this te
chnology is that the vertical etching in the small gate openings will
be remarkably enhanced by a self-organized process. Therefore the elec
trochemical etching provides a what we call ''self-compensation'' of t
he short channel effects. The effectiveness of this technology is evid
enced by the excellent performance combined with the alleviation of th
e threshold-voltage shift and suppression of transconductance degradat
ion in MODFET's with gate lengths below 0.1 mu m.