SELF-COMPENSATION OF SHORT-CHANNEL EFFECTS IN SUB-0.1-MU-M INALAS INGAAS MODFETS BY ELECTROCHEMICAL ETCHING/

Citation
D. Xu et al., SELF-COMPENSATION OF SHORT-CHANNEL EFFECTS IN SUB-0.1-MU-M INALAS INGAAS MODFETS BY ELECTROCHEMICAL ETCHING/, IEEE electron device letters, 19(12), 1998, pp. 484-486
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
07413106
Volume
19
Issue
12
Year of publication
1998
Pages
484 - 486
Database
ISI
SICI code
0741-3106(1998)19:12<484:SOSEIS>2.0.ZU;2-7
Abstract
We show that by making full use of the features of electrochemical etc hing in InAlAs/InGaAs heterostructures, deep gate grooves with small s ide etching can be fabricated. The most important advantage of this te chnology is that the vertical etching in the small gate openings will be remarkably enhanced by a self-organized process. Therefore the elec trochemical etching provides a what we call ''self-compensation'' of t he short channel effects. The effectiveness of this technology is evid enced by the excellent performance combined with the alleviation of th e threshold-voltage shift and suppression of transconductance degradat ion in MODFET's with gate lengths below 0.1 mu m.