X-RAY PROFILE ANALYSIS ON DISLOCATIONS AND HARDNESS OF COPPER-FILMS

Authors
SHAN FL WANG YM
Citation
Fl. Shan et Ym. Wang, X-RAY PROFILE ANALYSIS ON DISLOCATIONS AND HARDNESS OF COPPER-FILMS, Vacuum, 51(3), 1998, pp. 381-383
Citations number
9
Categorie Soggetti
Physics, Applied","Material Science
Journal title
Vacuum → ACNP
ISSN journal
0042207X
Volume
51
Issue
3
Year of publication
1998
Pages
381 - 383
Database
ISI
SICI code
0042-207X(1998)51:3<381:XPAODA>2.0.ZU;2-O
Abstract
Copper films were sputtered on a silicon substrate. Dislocation densit ies and dislocation distribution parameters in the copper films were d educed using the X-ray profile analysis method. Microhardness values o f copper film was calculated directly from the dislocation information . The results show that the calculated hardness values coincide with m easured and literature values. (C) 1998 Elsevier Science Ltd. All righ ts reserved.