EFFECTS OF IONIZATION POWER ON ION ENERGY-DISTRIBUTION IN IONIZED RF-SPUTTERING MEASURED BY AN ENERGY-RESOLVED MASS-SPECTROMETER

Citation
E. Kusano et al., EFFECTS OF IONIZATION POWER ON ION ENERGY-DISTRIBUTION IN IONIZED RF-SPUTTERING MEASURED BY AN ENERGY-RESOLVED MASS-SPECTROMETER, Surface & coatings technology, 109(1-3), 1998, pp. 177-181
Citations number
7
Categorie Soggetti
Materials Science, Coatings & Films
ISSN journal
02578972
Volume
109
Issue
1-3
Year of publication
1998
Pages
177 - 181
Database
ISI
SICI code
0257-8972(1998)109:1-3<177:EOIPOI>2.0.ZU;2-L
Abstract
In an ionized sputtering technique, it is crucial to give a proper ene rgy to the particles in order to improve film properties or to enhance directionality of the sputtered particles without causing disorder or other undesired damages to the growing film. In this study, ion energ y distribution has been investigated by an energy-resolved mass spectr ometer for ionized Ti sputtering in order to discuss effects of coil r .f. power and magnetron cathode r.f. power on energy distribution of A r+ and Ti+ ions arriving at the substrate. The cathode used in the exp eriment was a magnetron type with a 55-mm diameter Ti target. Ion ener gy distribution was measured by PPM-421 Plasma Monitor (Balzers) whose orifice to the ion analysis optics was set in front of the sputtering cathode with a distance of 200 mm. The coil r.f power and the cathode r.f. power were varied up to 200 W. The experimental results show tha t energy distribution of Ti+ ions was enhanced from a few tens of eV t o more than 100 eV as the coil r.f. power increased. The energy increa se of Ti+ ions by an r.f. coil plasma was more drastic for a lower cat hode r.f. power. As the cathode r.f. power increases, the energy of Ti + ions decreased, as a result of quenching of the r.f. coil plasma. Th e quenching is thought to be induced by the increase in the number of Ti atoms passing through the r.f. plasma region. Energy distribution o f Ar+ ions showed similar tendency to that of Ti+ ions. (C) 1998 Elsev ier Science S.A. All rights reserved.