The elemental distribution in an oxide-nitride-oxide (O-N-O) dielectri
c multi-layer in a dynamic random access memory (DRAM) device has been
investigated by elemental mapping using an electron energy-loss spect
rometer (EELS) combined with a field-emission (scanning) transmission
electron microscope (FE-(S)TEM). The O-N-O layer is designed as an ins
ulator between a single-crystal silicon substrate and a poly silicon c
apacitor. The nominal structure is an amorphous SiO2-Si3N4-SiO2 phase.
Two different approaches, utilizing both EELS point analysis and ener
gy-filtering transmission electron microscopy (EF-TEM), were made to c
onstruct the concentration profiles of low- and medium-atomic-number e
lements, N, O and Si. Further, the relative quantities of N, O and Si
atoms were processed to calculate the theoretical contrast due to high
-angle electron scattering from these atoms. The calculated contrast a
greed fairly well with the experimental contrast obtained by high-angl
e annular dark-field (HAADF) STEM.