ELECTROCHEMICAL-BEHAVIOR OF CU UNDERNEATH THIN ELECTROLYTE FILM IN ATMOSPHERE

Authors
Citation
Xy. Zhang et Yl. Du, ELECTROCHEMICAL-BEHAVIOR OF CU UNDERNEATH THIN ELECTROLYTE FILM IN ATMOSPHERE, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 14(6), 1998, pp. 547-550
Citations number
7
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
ISSN journal
10050302
Volume
14
Issue
6
Year of publication
1998
Pages
547 - 550
Database
ISI
SICI code
1005-0302(1998)14:6<547:EOCUTE>2.0.ZU;2-K
Abstract
An electrochemical cell was devised to investigate corrosion electroch emical behavior of metal underneath thin electrolyte film in atmospher e. The Piontelli's type of Luggin-Haber capillary was inserted from th e backward of working electrode. The results show that. cathodic proce ss on Cu is mainly affected by the thickness of the electrolyte film o f 0.5 mol/L HCl+1 mol/LNa2SO4 aqueous solution and its anodic dissolut ion changed from Tafel region to limiting diffusion current. Moreover, the corrosion potential of Cu in due media will increase with decreas e of the thickness of the film.