Interface traps in submicron buried-channel LDD pMOST's, generated und
er different stress conditions, are investigated by the direct-current
current-voltage (DCIV) technique. Two peaks C and D in the DCIV spect
rum are found corresponding to interface traps generated in the channe
l region and in the LDD region respectively. The new DCIV results clar
ify certain issues of the underlying mechanisms involved on hot-carrie
r degradation in LDD pMOST's. Under channel hot-carrier stress conditi
ons, the hot electron injection and electron trapping in the oxide occ
urs for all stressing gate voltage. How ever, the electron injection i
nduced interface trap spatial location changes from the LDD region to
the channel region when the stressing gate voltage changes from low to
high.