The viability of semiconductor deposition and treatment processes for
manufacturing are assessed and critical issues identified for CdTe, Cu
(InGa)Se-2, thin film silicon and amorphous silicon technologies. The
focus is on increasing throughput and decreasing costs. Specific issue
s include deposition rate, materials utilization, adhesion, uniformity
, equipment and process scale-up, compatibility with subsequent proces
sing, module performance and environmental concerns. (C) 1997 John Wil
ey & Sons, Ltd.