Iv. Malikov et Gm. Mikhailov, ELECTRICAL-RESISTIVITY OF EPITAXIAL MOLYBDENUM FILMS GROWN BY LASER-ABLATION DEPOSITION, Journal of applied physics, 82(11), 1997, pp. 5555-5559
The results of electrical resistivity measurements at room and low tem
peratures, and also of reflection high energy electron diffraction ana
lysis of thin (less than 110 nm) Mo films, grown by laser ablation dep
osition are presented. The films deposited under ultrahigh vacuum cond
itions on sapphire ((1) over bar 012) substrates at temperatures of 20
-750 degrees C are monocrystalline, with a [001] axis perpendicular to
the substrate. It is shown that the ratio of room temperature to resi
dual resistance which characterizes structural perfection, is in the r
ange 12-32 for the films 70 nm thickness. It increases abruptly at fil
m growth temperatures of 200-370 degrees C and changes weakly at furth
er temperature increase. The analysis of data on the size (thickness)
effect of the Mo films deposited at 750 degrees C revealed that the ef
fective electron mean free path is in the range 0.1-1 mu m for the fil
ms 15-110 nm thickness. Surface scattering was found to be the basic c
hannel of electron scattering at helium temperatures, with the specula
r coefficient q similar to 0.3 and residual bulk electron mean free pa
th similar to 100 mu m. At low temperatures T<25 K, the temperature de
pendent part of the resistance is approximated by rho(T) -rho(0) = AT(
n). The power degree smoothly varies from 3.2 in high quality films de
posited at 750 degrees C, where the effective electron mean free path
exceeds film thickness to 4.5 in the films deposited onto cold unannea
led substrates, where the effective electron mean free path is compara
ble with film thickness. (C) 1997 American Institute of Physics.