Chemical mechanical polishing of tungsten: Effect of tungstate ion on the electrochemical behavior of tungsten

Citation
K. Osseo-asare et al., Chemical mechanical polishing of tungsten: Effect of tungstate ion on the electrochemical behavior of tungsten, EL SOLID ST, 2(3), 1999, pp. 143-144
Citations number
13
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
ELECTROCHEMICAL AND SOLID STATE LETTERS
ISSN journal
10990062 → ACNP
Volume
2
Issue
3
Year of publication
1999
Pages
143 - 144
Database
ISI
SICI code
1099-0062(199903)2:3<143:CMPOTE>2.0.ZU;2-V
Abstract
The effect of tungstate ion on the electrochemical behavior of tungsten has been investigated using direct current potentiodynamic polarization. As th e concentration of tungstate ion increases, the anodic current increases an d shifts to less noble potentials. This unexpected result is attributed to the solubilization (via polymerization) of tungstate ions generated via W d issolution, by the tungstate species previously introduced into solution. W ith the iodate ion as a model oxidizer, the dissolution current was found t o increase in the presence of added tungstate ions. This suggests that tung state ions can facilitate the metal dissolution during tungsten chemical me chanical polishing. (C) 1999 The Electrochemical Society. S1099-0062(98)06- 079-9. All rights reserved.