Thermal loading of a thin layer with circular debonding over a substrate

Citation
H. Balkan et E. Madenci, Thermal loading of a thin layer with circular debonding over a substrate, INT J FRACT, 91(3), 1998, pp. 217-231
Citations number
16
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF FRACTURE
ISSN journal
03769429 → ACNP
Volume
91
Issue
3
Year of publication
1998
Pages
217 - 231
Database
ISI
SICI code
0376-9429(1998)91:3<217:TLOATL>2.0.ZU;2-D
Abstract
By using techniques appropriate to mixed boundary value problems, this stud y addresses the determination of stress intensity factors for a circular in terface debonding between a thin layer and a substrate subjected to nearly uniform temperature change. The solution method involves three-dimensional equilibrium equations of thermo-elasticity under axisymmetry conditions. Th e stress intensity factors are obtained by solving the resulting pair of co upled singular integral equations numerically.