T. Tanabe et A. Ohmori, Influence of deuterium implanted in materials surface on Balmer lines emission from backscattering deuterium, J NUCL MAT, 269, 1999, pp. 703-708
We have studied the influence of implanted deuterium (D) on Balmer lines em
ission from backscattering D atoms under Df irradiation of C, Al, Si, Mo an
d Pd for an incident energy ranging from 5 to 25 keV at a target temperatur
e from RT to 600 K. For clean surface, D-alpha photon intensity is proporti
onal to the backscattering coefficients calculated by the TRIM code for all
incident energies. For 15 and 20 keV injection, the intensity stays consta
nt with increasing fluence in accordance with the simulation that the backs
cattering coefficient is not influenced by implanted deuterium because the
mass of D is much less than that of the targets. Significant D-alpha photon
intensity increase is observed in Si with the injection of 5 keV or less e
nergy D+. The intensity gradually increases with the fluence until saturati
on after prolonged irradiation. With increase in the target temperature, th
e intensity increment is reduced and disappears above 500 K. The decay of t
he D-alpha photon intensity accompanied by thermal release of implanted deu
terium is also observed. Similar increment of the D-alpha intensity is obse
rved in C and Pd under 3 keV D+ injection but not at higher energy. In non-
hydride-forming materials as Al and Mo, no increment is observed at ail. It
is concluded that only dynamically retained deuterium at the top surface l
ayers in the hydride-forming materials given by lower energy incidence modi
fies the surface electronic structure and consequently enhances the electro
n capture process of the backscattering deuteron. In this paper, it is clea
rly shown that in recycling hydrogen from the wall highly energy excited hy
drogen particles are produced. The rate of this production is influenced by
the surface chemical state. If the amount of such excited hydrogen is sign
ificant, it should be taken into account for the energy recycling. (C) 1999
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