Cp. Chen et al., Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization, J VAC SCI B, 17(2), 1999, pp. 432-442
Based on the thermodynamic/kinetic model of the exchange mechanism, the ter
nary intermetallic compound NiAlxGa1-x (where 0 < x less than or equal to 1
)was identified as a metallization that may be used to fabricate Schottky e
nhanced contacts to n-GaAs. Experimental: phase equilibrium:studies of the
quaternary Al-Ga-Ni-As system, in conjunction with diffusion data available
in the literature, indicated that the phase NiAlxGa1-x fulfills the thermo
dynamic and kinetic requirements necessary for participation in an exchange
reaction with GaAs. Contacts to n-GaAs were fabricated by sputter depositi
on of NiAlxGa1-x metallizations, with compositions corresponding to x = 0.0
0, 0.25, 0.50, 0.75 and 1.00. These contacts were subjected to rapid therma
l processing, and analyzed using cross-sectional high resolution transmissi
on electron microscopy and I-V characterization. Electron microscopy and co
ncomitant electron dispersive spectroscopic analysis indicated that a very
thin (2.5 nm) interfacial region of AlxGa1-xAs was formed in annealed conta
cts for which x > 0.00, in accordance with the exchange mechanism model. Sc
hottky barrier enhancement was also observed in all annealed contacts for w
hich x > 0.00. The degree of Schottky barrier enhancement was shown to be d
ependent upon the initial composition of the metallization, again in,accord
ance with the prediction of the exchange mechanism model. Schottky barrier
heights as high:as 0.96 eV were obtained under the optimum annealing condit
ions of 400 degrees C for 1 min. However, these experimentally determined S
chottky barrier heights were somewhat smaller than the values that were ant
icipated based upon the exchange mechanism model. Potential reasons for the
se discrepancies were discussed. Overall, it was demonstrated that the ther
modynamic/kinetic model of the exchange mechanism is a powerful tool for id
entifying metallizations that may be used to enhance the Schottky barriers
of contacts to n-GaAs. (C) 1999 American Vacuum Society. [S0734-211X(99)046
02-8].