Various high-temperature polymer materials were preconditoned by wet-chemic
al methods and ion-assisted plasma processes, respectively. The polymer sur
faces were investigated by SEM, AFM and stylus profilometry. The adhesion s
trength was controlled by a peel test. Measurement of the specific electric
al conductivity, helium gas tightness and soldering experiments provide val
uable information concerning possible applications. Using wet-chemical meth
ods, filler particles like mineral compounds are normally dissolved complet
ely. A mechanical anchoring in remaining holes provides peel strength value
s of more than 1 N mm(-1) after thermal ageing. In contrast to this, plasma
-etching processes attack the polymer material preferentially. Therefore, m
ineral particles must still adhere strongly to the polymer to provide mecha
nical adhesion sites for the metal layers. An adhesion strength of about 1
N mm(-1) was obtained likewise on different substrate materials. (C) 1999 E
lsevier Science S.A. All rights reserved.