We have investigated the diffusion enhancement mechanism of boron-enhanced
diffusion (BED), wherein boron diffusivity is enhanced four to five times o
ver the equilibrium diffusivity at 1050 degrees C in the proximity of a sil
icon layer containing a high boron concentration. It is demonstrated that B
ED is driven by excess interstitials injected from the high boron concentra
tion layer during annealing. For evaporated layers, BED is observed above a
threshold boron concentration between 1% and 10%, though it appears to be
closer to 1% for B-implanted layers. For sub-keV B implants above the thres
hold, BED dominates over the contribution from transient-enhanced diffusion
to junction depth. For 0.5 keV B, this threshold implantation dose lies be
tween 3 x 10(14) and 1 x 10(15) cm(-2). It is proposed that the excess inte
rstitials responsible for BED are produced during the formation of a silico
n boride phase in the high B concentration layers. (C) 1999 American Instit
ute of Physics. [S0003-6951(99)02117-8].