Boron-enhanced diffusion of boron from ultralow-energy ion implantation

Citation
A. Agarwal et al., Boron-enhanced diffusion of boron from ultralow-energy ion implantation, APPL PHYS L, 74(17), 1999, pp. 2435-2437
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
74
Issue
17
Year of publication
1999
Pages
2435 - 2437
Database
ISI
SICI code
0003-6951(19990426)74:17<2435:BDOBFU>2.0.ZU;2-2
Abstract
We have investigated the diffusion enhancement mechanism of boron-enhanced diffusion (BED), wherein boron diffusivity is enhanced four to five times o ver the equilibrium diffusivity at 1050 degrees C in the proximity of a sil icon layer containing a high boron concentration. It is demonstrated that B ED is driven by excess interstitials injected from the high boron concentra tion layer during annealing. For evaporated layers, BED is observed above a threshold boron concentration between 1% and 10%, though it appears to be closer to 1% for B-implanted layers. For sub-keV B implants above the thres hold, BED dominates over the contribution from transient-enhanced diffusion to junction depth. For 0.5 keV B, this threshold implantation dose lies be tween 3 x 10(14) and 1 x 10(15) cm(-2). It is proposed that the excess inte rstitials responsible for BED are produced during the formation of a silico n boride phase in the high B concentration layers. (C) 1999 American Instit ute of Physics. [S0003-6951(99)02117-8].