An electroless copper deposition process consisting of two stages: (1) form
ing gold catalytic centers, and (2) electroless copper deposition, was stud
ied in this paper, The changes of the chemical state of sulfur in photograp
hic gelatin before and after electroless copper deposition were studied by
X-ray photoelectron spectrometry. The depth distribution of copper and gold
within the electrically conductive layer produced by electroless copper de
position was determined and the mechanism of electroless copper deposition
catalyzed by gold in the photographic gelatin layer was discussed. The resu
lts indicated that under acidic conditions (pH 3.20), methionine sulfoxide
in the gelatin macromolecule had relatively high reducing power When the ge
latin sample was immersed into the chloroauric acid solution, methionine su
lfoxide and methionine were oxidized to methionine sulfone, reducing Au3+ t
o colloid gold which acted as the catalytic center at the initial stage of
the electroless copper deposition. During the electroless deposition the re
duction of Cu2+ by HCHO could continue, and el en the copper completely cov
ered the gold because the reaction was autocatalyzed by newly formed copper
, (C) 1999 The Electrochemical Society. S0013-4651(98)06-006-6, All rights
reserved.