K. Strubbe et al., Electroreduction of Co2+ and Ni2+ at III-V semiconductors and properties of the semiconductor/metal interfaces formed, J ELCHEM SO, 146(4), 1999, pp. 1412-1420
The electrochemical deposition of Ni and Co on GaAs and GaP at pH 5 was inv
estigated by means of cyclic voltammetry and rotating disk voltammetry. The
current-potential behavior of the two semiconductors in dilute metal ion s
olutions appeared to he different: at n-GaP, a stepwise reduction of the me
tal ions was observed whereas at n-GaAs this was not the case This observat
ion can be explained on the basis of two alternative reaction mechanisms fo
r the reduction of the monovalent intermediate. Under well-chosen condition
s of deposition potential and metal ion concentration, it appeared to he po
ssible to form adherent n-GaAs/Co, n-GaAs/Ni, and n-GaP/Co Schottky contact
s with good rectifying properties. The barrier height Phi(B) of the n-GaAs/
Ni contacts appeared to increase as a function of time, leading to values o
f Phi(B) which were dependent on the deposition potential V-D. At n-GaAs/Co
and n-GaP/Co junctions, this aging effect was absent, leading to values of
the barrier height which were independent of V-D. It was further observed
that the occurrence of side reactions during metal deposition may exert a g
reat influence upon the properties of the metal/semiconductor junctions for
med. (C) 1999 The Electrochemical Society. S0013-4651(98)07-026-8. All righ
ts reserved.