L. Zhang et al., Inhibition of alumina deposition during tungsten chemical mechanical planarization through the use of citric acid, J ELCHEM SO, 146(4), 1999, pp. 1442-1447
The beneficial effects of citric acid in inhibiting alumina particle deposi
tion onto silica areas during tungsten chemical planarization ware investig
ated. The electrokinetics of alumina in the presence of citric acid and the
uptake of citric acid by alumina were studied experimentally. At a pH of 4
, as the citric acid concentration was increased, the zeta potential of alu
mina became less positive and reversed sign. Slurry dip tests and small-sca
le polishing experiments carried out and the surface cleanliness of contami
nated oxide surfaces was characterized with a field emission scanning elect
ron microscope and image analysis. It has been demonstrated that citric aci
d is very effective in controlling alumina contamination on oxide surfaces
when added into the slurry. Electrochemical tests showed that citric acid d
oes not significantly attack tungsten films. A mechanism for the interactio
n between citric acid and alumina particles has been proposed. (C) 1999 The
Electrochemical Society. S0013-4651(98)07-070-0. All rights reserved.