We examine how channeling affects ion implantation depth profiles in silico
n and whether channeling can be beneficial for achieving a sharp end-of-ran
ge in the profile. Accurate modeling of channeling requires a molecular dyn
amics program with a realistic electronic stopping model. We have implement
ed the local electronic stopping model originally proposed by Cai et al. an
d the Firsov model to describe energy losses in inelastic collisions betwee
n recoiling ions and target atoms. Simulations of 0.25-15 keV B and As ions
in the [100], [110] [111] and off-channel directions in silicon show that
channeling effects become unimportant at keV energies in the [100] and [111
] directions, whereas in the [110] channel they persist down to the very lo
west energies. Implantation into the [100] channel gives optimal sharpness
of the profiles down to implantation depths of roughly 400 Angstrom indicat
ing that no tilt is necessary for the very shallow implants needed in next-
generation semiconductors.