Efficient techniques for accurate modeling and simulation of substrate coupling in mixed-signal IC's

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems, Magnified noise coupling through the common chip substrate has made the design and ve rification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that accelerates operator appl ication in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effec ts in mixed-signal integrated circuits.