Characterisation of offset lithographic films using microelectronic test structures

This paper reports on the use of microelectronic test structures to charact erise a novel fabrication technique for thin-film electronic circuit boards . In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical l ines are electrically evaluated and these compared with optical and surface profiling measurements.