Slow traps and interface traps density has been measured using low frequenc
y (10 Hz) noise and charge pumping measurements. The study has been carried
out on n-channel metal-oxide-semiconductor transistors with ultra thin gat
e dielectrics prepared by rapid thermal oxidation (RTO) and low pressure ra
pid thermal chemical vapor deposition. For both deposition methods, the int
erface trap characteristics have been studied as a function of nitrogen con
centration as well as thermal annealing parameters (ambient and temperature
). Experimental results have shown that a stacked dielectric combined RTO g
ate oxide (grown under N2O) and chemical vapor deposition oxynitride (cappi
ng layer with 8%, atomic nitrogen concentration), offers a solution for gat
e dielectrics with thickness greater than or equal to 2 nm. (C) 1999 Elsevi
er Science B.V. All rights reserved.