Temperature effects on the Si/SiO2 (0.5-5 nm thick) interface defects and s
uboxide distribution are studied by electron paramagnetic resonance and con
ventional X-ray photoelectron spectroscopy. The experiments are made on por
ous (66% porosity) silicon samples (10 mu m thick) thermally oxidized in th
e 400-1000 degrees C temperature range. Electron paramagnetic resonance mea
surements (similar to 9.6 GHz, 25 degrees C) show a decrease of the density
of broken bonds called P-bl when the oxidation temperature increases. Howe
ver no change of the interfacial structure is observed through the suboxide
distribution. We interpret our results in terms of viscoelastic relaxation
. (C) 1999 Published by Elsevier Science B.V. All rights reserved.