Conventional transient liquid phase (TLP) bonds between the structural inte
rmetallic compound NiAl and nickel base superalloys suffer from the formati
on, during bonding, of undesired stable second phases. The present paper in
vestigates the extent to,which this problem can be overcome by the use of a
wide gap TLP bonding process, employing composite interlayers. The paper c
onsiders TLP bonding of single crystal NiAl-Hf to ii polycrystalline supera
lloy Martin-Marietta (MM) 247 by means of an NiAl-Cu composite preform. The
paper contrasts the relative influence of the TLP process and post-bond he
at treatment on joint microstructure.