Tungsten-containing amorphous carbon films deposited by pulsed vacuum arc

Citation
Or. Monteiro et al., Tungsten-containing amorphous carbon films deposited by pulsed vacuum arc, THIN SOL FI, 342(1-2), 1999, pp. 100-107
Citations number
20
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
342
Issue
1-2
Year of publication
1999
Pages
100 - 107
Database
ISI
SICI code
0040-6090(19990326)342:1-2<100:TACFDB>2.0.ZU;2-J
Abstract
Amorphous carbon (a-C) films with a wide range of W concentrations have bee n produced by mixing C+ and Wn+ plasma streams originated in filtered catho dic are plasma sources. Adhesion of these films to silicon substrates was v ery high, and was achieved by atomically mixing the film and the Si at the interface. The deposition of the tungsten-doped amorphous carbon films was carried out at room temperature, and the energy of the depositing ions was in the range of 100-6 keV. The films were characterized by TEM, XRD, XPS, R ES and Raman spectroscopy. Small additions of W to amorphous carbon signifi cantly decrease the magnitude of the compressive stresses that are present in these films. The corresponding decrease in hardness with increasing W co ntent was not nearly as significant. Film hardness varied between 63 GPa (w ith 1 at.% W) and 20 GPa (the bulk value for WC) and depended not only on t he W content but also on the depositing ion energy. At W contents between 2 0 and 50 at.%, the film consisted of crystalline WC dispersed in an amorpho us C matrix. At W content below 20 at.%, the WC present in the film was amo rphous, and the film consisted then of mixtures of a-WC and a-C. (C) 1999 E lsevier Science S.A. All rights reserved.