Aluminium oxide tunnel junctions: influence of preparation technique, sample geometry and oxide thickness

Citation
D. Diesing et al., Aluminium oxide tunnel junctions: influence of preparation technique, sample geometry and oxide thickness, THIN SOL FI, 342(1-2), 1999, pp. 282-290
Citations number
35
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
342
Issue
1-2
Year of publication
1999
Pages
282 - 290
Database
ISI
SICI code
0040-6090(19990326)342:1-2<282:AOTJIO>2.0.ZU;2-7
Abstract
Tunnel junctions of the type Al/Al oxide/Ag can emit hot electrons of about 2 eV to an adjacent electrolyte and cause redox reactions. We developed a production technique of such tunnel systems, which are stable at room tempe rature in atmosphere and in electrolyte. Two types of Al base electrodes (w ires and evaporated films on glass), three types of oxide films (gas phase oxidation, anodic oxidation and physical vapour deposition) were combined w ith an Ag top electrode film of 15 nm thickness. PVD oxide films are porous with a large thickness distribution. This causes a rough silver top electr ode and therefore a weak corrosion resistance. Stable oxide films were only obtained for the pairs Al wire/anodic oxide and Al film/gas phase oxide. T he oxides are almost equal in their properties and form dense homogenous fi lms independent of the sample geometry. Anodic films can be formed with var ious thicknesses, but ionic currents may exceed the tunnel currents. A succ essful layer sequence was Al film/gas phase oxide (2.5 nm)/Ag (15 nm) with an emission current of hot electrons of about 1 mA/cm(2). (C) 1999 Elsevier Science S.A. All rights reserved.