A self-aligned gate pseudomorphic high-electron-mobility transistor (PHEMT)
was developed through nonalloyed PdGe ohmic contact on an n(+)-GaAs cap la
yer. The lowest contact resistivity obtained was 1.2X10(-7) Ohm cm(2) at 30
0 degrees C. This allows us to change the sequence on the formation of sour
ce/drain and gate electrodes in the process of PHEMT fabrication, namely se
lf-aligned gate PHEMT. Performance of the self-aligned gate PHEMT was remar
kably pronounced with annealing temperature or the decrease of contact resi
stivity. This is due to the solid-phase regrowth of highly Ge-doped GaAs be
low the PdGe contact, which acts to reduce barrier height for electron tunn
eling. (C) 1999 American Institute of Physics. [S0003-6951(99)03619-0].