PACVD has been used to obtain SIBCN thin films for the first time at low te
mperatures (250 degrees C) from a single-sourer precursor. Tn comparison wi
th PACVD BCN, the B:C ratio is the same, but there is a slightly increased
N content, and the presence of Si improves the hardness and adhesion charac
teristics. XPS and FTIR results suggest that most Si atoms are bonded to N
and C, with the C being mainly sp(2)/sp(3) hybridized CC and C-N bonds, whi
le B is bonded to N, also with sp(2)/sp(3) hybridization.