In this letter, we demonstrate that the commonly assumed:Arrhenius law is i
nconsistent with extrapolation of data-retention time-to-failure of nonvola
tile memories in highly accelerated life-tests. We argue that the retention
time, namely log(t(R)), varies linearly with temperature T rather than wit
h 1/T as commonly assumed, yielding an important reduction in the extrapola
ted time-to-failure. Extensive experimental results demonstrate the physica
l consistency of the new model. In particular, data-retention of EPROM devi
ces and leakage current of interpoly dielectric and gate oxide have been in
vestigated over a wide range of temperatures. Finally, it is shown that our
model reconciles seemingly controversial activation energy data from the l
iterature.