We have developed a simple process to form epitaxial CoSi2 for shallow junc
tion. Prior to metal deposition, the patterned wafers were treated with HF-
vapor passivation. As observed by scanning tunneling microscopy (STM), this
HF, treatment drastically improves the native oxide-induced sur face rough
ness. The epitaxial behavior was confirmed by cross-sectional transmission
electron microscopy (TEM), Decreased sheet resistance and leakage current,
and improved thermal stability are displayed by the HF treated samples, whi
ch is consistent with STM and TEM results.