A planar inductive discharge is used to hydrogenate polysilicon thin-film t
ransistors (poly-Si TFT's). Experimental results indicate that inductive di
scharges operate at higher plasma densities, thereby capable of shortening
the hydrogenation time. In addition, to promote the ionization of hydrogen,
Ar gas is also introduced to H-2 plasma during hydrogenation. Furthermore,
me discuss the mechanism of Ar enhanced hydrogenation and the characterist
ics of H-2/Ar mixed plasma. Moreover, the posthydrogenation anneal is utili
zed to further enhance passivation efficiency and improve the reliability o
f poly-Si TFT's.